The electronics sector, where everything is being made smaller and more compact, is one of the sectors that benefits most from CFD analysis. Cooling performance can be calculated before your product is ever built.
Analysis at four scales
Electronics cooling analyses are set up at four different levels depending on the scale of your problem:
Some of the information electronic board, device and system designers can obtain through CFD analysis:
Natural convection air flow and heat transfer inside an AC/DC converter were examined with CFD analysis. In this fanless design, the component temperatures that would be encountered were calculated, establishing before production whether critical components stayed within their temperature limits.
At the earliest possible design stage. Analysis carried out while board layout, enclosure ventilation and fan selection can still be changed prevents the large majority of thermal problems that otherwise surface after prototyping.
That depends on power density, enclosure geometry and ambient temperature. We solve both scenarios with CFD analysis and show numerically whether a fanless design can keep critical components within their temperature limits.
If the problem is a single component overheating, component or board level; if it is air distribution inside an enclosure and fan selection, device level; if multiple devices heat a shared environment, cabinet level. We define the scope together.
If you have thermal measurements we calibrate the model against them. Where no measurements exist, we state material and boundary condition assumptions explicitly in the report so the results can be interpreted with the right confidence.
Tell us about your board, device or cabinet, and we'll calculate cooling performance before you build it.
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